Our Purpose
TERADYNE, where experience meets innovation and driving excellence in every connection. We are fueled by creativity and diversity of thought and in our workforce. Our employees are supported to innovate and learn something new every day. We cultivate a culture of inclusion for all employees that respects their own strengths, views, and experiences. We believe that our differences enable us to be a better team – one that makes better decisions, drives innovation and delivers better business results.
Opportunity Overview
This role is ideal for an undergraduate student who has completed their first year of Engineering coursework and is eager to apply foundational concepts from Physics, Chemistry and Mathematics to the thermal and mechanical challenges of electronic circuit packaging. The co-op will gain hands-on experience using industry-standard CAD tools to model, analyze, and optimize packaging structures for thermal performance and manufacturability.
- Assist in the design, prototyping, and testing of mechanical components and systems.
- Create and revise CAD models using tools such as Allegro Package Designer, and or SolidWorks.
- Support engineering team with data collection, documentation, and test setup.
- Perform basic calculations of Thermal and Mechanical Reliability using Cadence Celsius and assist with engineering analysis under supervision.
- Participate in team meetings and design reviews.
- Document procedures, test results, and findings for future reference and reporting.
All About You
We seek individuals who share our passion and willingness. Our commitment to customer success drives us to go the extra mile. If you’re ready to join us in this mission, take a closer look at the minimum criteria for the position.
- Currently enrolled in a Bachelor’s degree program in Engineering or related field.
- Completion of at least one year of undergraduate coursework, including Physics and Chemistry.
- Strong interest in thermal and mechanical aspects of electronic circuit packaging.
- Familiarity with basic engineering practices, mechanical components, and materials.
- Experience with CAD software (e.g., SolidWorks, Autocad, or similar) from coursework or personal projects.
- Strong communication skills and willingness to ask questions and learn.
- Ability to work collaboratively in a team environment.
- Detail-oriented with strong organizational skills
Preferred Skills (Not Required)
- Familiarity with basic thermal simulation tools or heat transfer analysis methods.
- Exposure to electronic packaging principles such as PCB stacking, thermal vias, or heat sink design.
- Exposure to 3D printing or other prototyping tools.
- Basic understanding of thermodynamics, mechanics, or materials science.
- Experience with technical writing or lab reports.
We are only considering candidates local to position location and are unable to provide relocation for this position.
This position is not eligible for visa sponsorship.
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